DiSCAN by MiCROTEC is the exciting result of years of research and development and combines the most advanced know-how and high technology available on the world market. This new and versatile 3D scanner module is built on the principles of laser beam triangulation and differential reflective light scanning.

The versatile DiSCAN module is used in many MiCROTEC systems such as WANESCAN, the full profile wanescanner, DiSHAPE, the 3D log measuring system which provides true shape and dimensional representations of logs and lumber. Additionally, it is found in material handling systems such as CHiPSCAN for determining the volume of bulk material.

DiSCAN works with a precision never seen before. It cannot be outperformed even at the highest feed rates. It works both in lengthwise and crossways transport of lumber.

Standardized and factory-calibrated DiSCAN modules are installed in existing or new mills quickly and easily. This means significant time savings in planning, installation, start-up and maintenance. DiSCAN is characterized by added value to virtually every operation, has an extremely short pay-back period, and facilitates steady improvements in recovery and financial earnings.

 

Seven unique reasons for choosing DiSCAN by MiCROTEC:

• Standardized 3D modules for multiple applications and systems.
• Combination of double laser triangulation and a differential reflective light scanning.
• Exact measurement of shape and dimension of logs, cants, lumber and boards.
• Highest precision even at the fastest conveyor speeds
• Can be used for lumber transported lengthwise or crossways
• Costs savings in planning, installation, start-up and maintenance
• Increased plant performance and added economic value